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600ma low dropout linear regulator ap1117m data sheet 1a uldo regulator with enable ap2318a 1 may. 2011 rev 2. 0 bcd semiconductor manufacturing limited figure 1. package type of ap2318a psop-8 general description the ap2318a is a series of ultra low dropout regulators optimized for low voltage applications where transient response and minimum input voltage are critical. the ap2318a provides current limit and thermal shutdown function. its circuit includes a trimmed bandgap reference to assure output voltage accuracy to be within 1.5%. on-chip thermal shutdown provides protection against any comb ination of overload and ambient temperatures th at would cause excessive junction temperatures. the ap2318a has adjustable version, which can set the output voltage through two external resistors. the ap2318a is available in the standard dfn-3x3-8 and psop-8 packages. features wide operating voltage range: 2.5v to 12v output voltage accuracy: 1.5% on-chip thermal shutdown esd rating: 3000v (human body model) 600v (machine model) operation junction temperature: -40 o c to 125 o c applications notebook usb device add-on card dvd player pc motherboard dfn-3x3-8
600ma low dropout linear regulator ap1117m data sheet 1a uldo regulator with enable ap2318a 2 may. 2011 rev 2. 0 bcd semiconductor manufacturing limited figure 2. pin configuration of ap2318a (top view) pin configuration mp package (psop-8) nc nc en vin vin adj gnd vout 1 2 3 4 8 7 6 5 pin description pin number pin name function dfn-3x3-8 psop-8 1, 2 3, 4 vin input voltage 3, 4 6 vout output voltage 5 7 adj adjustable voltage 6 8 gnd ground 7 1, 5 nc no connection 8 2 en on/off control 1 2 3 45 6 7 8 dn package (dfn-3x3-8) vout vin vout en nc gnd adj vin
600ma low dropout linear regulator ap1117m data sheet 1a uldo regulator with enable ap2318a 3 may. 2011 rev 2. 0 bcd semiconductor manufacturing limited functional block diagram figure 3. functional block diagram of ap2318a thermal shutdown current limit error amplifier bandgap reference enable rc compensation ovp 1, 2 (3, 4) 3, 4 (6) 5 (7) 6 (8) 8 (2) v fb vin vout adj gnd en a (b) a: dfn-3x3-8 b: psop-8
600ma low dropout linear regulator ap1117m data sheet 1a uldo regulator with enable ap2318a 4 may. 2011 rev 2. 0 bcd semiconductor manufacturing limited ordering information circuit type package dn: dfn-3x3-8 adj: adjustable output e1: lead free g1: green ap2318a - tr: tape and reel blank: tube bcd semiconductor's pb-free products, as designa ted with "e1" suffix in the part num ber, are rohs compliant. products with "g1" suffix are available in green packages. package temperature range part number marking id packing type lead free green lead free green dfn-3x3-8 -40 to 125 o c ap2318adn-adjtrg1 b7b tube psop-8 -40 to 125 o c ap2318amp-adje1 ap2318amp- adjg1 2318a-adje1 2318a-adjg1 tube ap2318amp-adjtre1 ap2318amp- adjtrg1 2318a-adje1 2318a-adjg1 tape & reel mp: psop-8
600ma low dropout linear regulator ap1117m data sheet 1a uldo regulator with enable ap2318a 5 may. 2011 rev 2. 0 bcd semiconductor manufacturing limited recommended operating conditions note 1: stresses greater than those listed under "absolute maximum ratings" ma y cause permanent damage to the device. these are stress ratings only, and functi onal operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. exposure to "absolute maximum ra tings" for extended periods may affect device reliability. note 2: absolute maximu m ratings indicate limits beyond which damage to the component ma y occur. electrical specifica- tions do not apply when operating the device outside of its operating ra tings. the maximum allowabl e power dissipation is a function of the maximum junction temperature, t j (max) , the junction-to-ambient thermal resistance, ja, and the ambient tem- perature, t a. the maximum allowable power dissipation at any ambient temperature is calculated using: p d (max)=(t j (max) - t a )/ ja. exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown. parameter symbol value unit input voltage v in 15 v operating junction temperature t j 150 o c storage temperature range t stg -65 to 150 o c lead temperature (soldering, 10sec) t lead 260 o c thermal resistance, junction to ambient (note 2) ja dfn-3x3-8 120 o c/w psop-8 108 esd (human body model) esd 3000 v esd (machine model) esd 600 v parameter symbol min max unit input voltage v in 2.5 12 v enable voltage v en 12 v operating junction temperature range t j -40 125 o c absolute maximum ratings (note 1)
600ma low dropout linear regulator ap1117m data sheet 1a uldo regulator with enable ap2318a 6 may. 2011 rev 2. 0 bcd semiconductor manufacturing limited parameter symbol conditions min typ max unit reference voltage v ref ap2318a-adj, i out =10ma, v in -v out =2v, t j =25 o c,10ma i out 1a, v out +2v v in 12v 1.231 1.225 1.250 1.250 1.269 1.275 v maximum output current i out (max) v in -v out =2v 1.2 1.5 a line regulation v rline ap2318a-adj i out =10ma, v out +2v v in 12v 1 6 mv i out =10ma, 2.5v v in 12v 1 6 mv load regulation v rload ap2318a-adj v in =v out +2v, 10ma i out 1a 1 15 mv v in =2.5v, 10ma i out 1a 1 15 mv dropout voltage v drop ? v out ( ? v ref )=1%, v out > 2v, i out =1a 0.5 v adjust pin current i adj 0.05 1 a minimum load current i load (min) v out +2v v in 12v (adj only) 1.7 5 ma quiescent current i q v in =v out +2v, i out =0ma 250 a rms output noise (% of v out ) v noi t a =25 o c, 10hz f 20khz 0.003 % thermal shutdown temperature 150 o c thermal shutdown hysteresis 25 o c enable input voltage v en enable logic low 0.8 v enable logic high 2.25 enable input current i en v en =2.25v 5 a v en =0.8v 4 a thermal resistance (junction to case) jc dfn-3x3-8 15 o c/w psop-8 12 electrical characteristics operating conditions: 2.5v v in 12v, c in =1 f, c out =2.2 f, t j =25 o c, unless otherwise specified. (p maxi- mum power dissipation). limits appearing in boldface type apply over the entire junction temperature range for operation of -40 o c to 125 o c.
600ma low dropout linear regulator ap1117m data sheet 1a uldo regulator with enable ap2318a 7 may. 2011 rev 2. 0 bcd semiconductor manufacturing limited typical performance characteristics figure 6. supply current vs. input voltage 012345678 0 50 100 150 200 250 300 350 400 ap2318a-adj v out =1.25v t c =-40 o c t c =25 o c t c =125 o c supply current ( a) input voltage (v) figure 7. supply current vs. case temperature -40-20 0 20406080100120 300 304 308 312 316 320 324 328 332 336 340 ap2318a-adj v in =3.25v v out =1.25v supply current ( a) case temperature ( o c) 0123456789101112 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 output voltage (v) input voltage (v) ap2318a-adj v out =2.5v t c =25 o c i out =10ma i out =500ma i out =1000ma figure 4. output voltage vs. input voltage 0 200 400 600 800 1000 1200 1400 1600 1800 2000 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 output voltage (v) output current (ma) ap2318a-adj v out =2.5v v in =3.5v t c = -40 o c t c =25 o c t c =125 o c figure 5. output volt age vs. output current
600ma low dropout linear regulator ap1117m data sheet 1a uldo regulator with enable ap2318a 8 may. 2011 rev 2. 0 bcd semiconductor manufacturing limited typical performance char acteristics(continued) figure 8. supply curren t vs. output current 0 150 300 450 600 750 900 1050 1200 1350 1500 0 2 4 6 8 10 12 14 16 18 20 t c =25 o c t c =-40 o c t c =125 o c ap2318a-adj v in =3.25v v out =1.25v supply current (ma) output current (ma) figure 9. supply current vs. output current 0 150 300 450 600 750 900 1050 1200 1350 1500 0 2 4 6 8 10 12 14 16 18 20 ap2318a-adj v out =1.25v t c =25 o c v in =3.25v v in =2.5v v in =12v supply current (ma) output current (ma) figure 11. psrr vs. frequency 10 100 1k 10k 100k 0 10 20 30 40 50 60 70 80 90 100 psrr (db) frequency (hz) ap2318a-adj v in =3v to 4v v out =1.25v c in =1 f, c out =2.2 f i load =10ma 0 100 200 300 400 500 600 700 800 900 1000 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 0.65 ap2318a-adj v out =2.5v t c =-40 o c t c = 25 o c t c =125 o c dropout voltage (v) output current (ma) figure 10. dropout voltage vs. output current
600ma low dropout linear regulator ap1117m data sheet 1a uldo regulator with enable ap2318a 9 may. 2011 rev 2. 0 bcd semiconductor manufacturing limited typical performance ch aracteristics (continued) figure 13. load transient response figure 12. load transient response v in =2.5v, v out =1.25v, i out =1 to 500ma, c in =1 f, c out =2.2 f v in =2.5v, v out =1.8v, i out =1ma to 1a, c in =1 f, c out =2.2 f ? v out 50mv/div i out 200ma/div ? v out 100mv/div i out 500ma/div
600ma low dropout linear regulator ap1117m data sheet 1a uldo regulator with enable ap2318a 10 may. 2011 rev 2. 0 bcd semiconductor manufacturing limited typical application figure 14. typical application of ap2318a adj version, v out =1.25*(r1+r2)/r2 + + ap2318a-adj vout vin en adj gnd v out v in c in 1 f c out 2.2 f r1 r2
600ma low dropout linear regulator ap1117m data sheet 1a uldo regulator with enable ap2318a 11 may. 2011 rev 2. 0 bcd semiconductor manufacturing limited mechanical dimensions unit: mm(inch) dfn-3x3-8 2.900(0.114) 3.100(0.122) 2.900(0.114) 3.100(0.122) 2.200(0.087) 2.400(0.094) 1.400(0.055) 1.600(0.063) n8 n5 n4 n1 0.375(0.015) 0.575(0.023) 0.180(0.007) 0.300(0.012) 0.153(0.006) 0.253(0.010) 0.000(0.000) 0.050(0.002) 0.700(0.028) 0.800(0.031) pin #1 identification b s c 0 . 6 5 0 ( 0 . 0 2 6 ) pin 1 dot by marking
600ma low dropout linear regulator ap1117m data sheet 1a uldo regulator with enable ap2318a 12 may. 2011 rev 2. 0 bcd semiconductor manufacturing limited mechanical dimens ions (continued) unit: mm(inch) psop-8 8 5.800(0.228) 6.200(0.244) 1.270(0.050) 0.400(0.016) 3.800(0.150) 4.000(0.157) 0.330(0.013) 0.510(0.020) 0.050(0.002) 0.150(0.006) 1.350(0.053) 1.750(0.069) 4.700(0.185) 1.270(0.050) typ 0 0.250(0.010) 0.170(0.007) 1.350(0.053) 1.550(0.061) 2.313(0.091) 2.513(0.099) 3.202(0.126) 3.402(0.134) 5.100(0.201) note: eject hole, oriented hole and mold mark is optional.
important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd., shenzhen office unit a room 1203, skyworth bldg., gaoxin ave.1.s., nanshan district, shenzhen, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corp. 30920 huntwood ave. hayward, ca 94544, usa tel : +1-510-324-2988 fax: +1-510-324-2788 - headquarters bcd semiconductor manufacturing limited no. 1600, zi xing road, shanghai zizhu sc ience-based industrial park, 200241, china tel: +86-21-24162266, fax: +86-21-24162277 bcd semiconductor manufacturing limited important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited

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